5G brings more design challenges for smartphone manufacturers

While companies on both sides of 5G connectivity are preparing for the next generation technology, new obstacles for its implementation continue to emerge. Part makers already have the first 5G modems ready for production, but it seems that integrating them in smartphones will require more than placing one more chip on the motherboard.

Tests of the available solutions showed that during high-performance use, 5G modems require considerable heat dissipation, or in other words, cooling. Cooling a smartphone is already a difficult task, with devices being so thin and tightly packed, so an ...

Source PhoneArena https://ift.tt/2p9Fdgh
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